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Intel Corporation, Samsung Electronics and TSMC have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.
The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.
Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.
"There is a long history of innovation and problem solving in our industry that has delivered wafer transitions resulting in lower costs per area of silicon processed and overall industry growth." said Bob Bruck, vice president and general manager, Technology Manufacturing Engineering in Intel's Technology and Manufacturing Group. "We, along with Samsung and TSMC, agree that the transition to 450mm wafers will follow the same pattern of delivering increased value to our customers."
Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.
"The transition to 450mm wafers will benefit the entire ecosystem of the IC industry, and Intel, Samsung, TSMC will work together with suppliers and other semiconductor manufacturers to actively develop 450mm capability," said Cheong-Woo Byun, senior vice president, Memory Manufacturing Operation Center, Samsung Electronics.
In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities (also known as "fabs") were introduced in 1991.
Keeping in line with the historical pace of growth, Intel, Samsung and TSMC agree that 2012 is an appropriate target to begin the 450mm transition. Given the complexity of integrating all of the components for a transition of this size, the companies recognize that consistent evaluation of the target timeline will be critical to ensure industry-wide readiness.
"Increasing cost due to the complexity of advanced technology is a concern for the future," said Mark Liu, TSMC's senior vice president of Advanced Technology Business. "Intel, Samsung, and TSMC believe the transition to 450mm wafers is a potential solution to maintain a reasonable cost structure for the industry."
The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.
Source: Intel
Intel, Samsung, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
Dell Will Fix Faulty Vostro 1310 and 1510 Laptop Keyboards
Dell Will Fix Faulty Vostro 1310 and 1510 Laptop Keyboards
Dell on Friday said it has suspended shipment of the two Vostro 1310 and 1510 laptops in Europe after first owners alarmed that these laptops are shipping to Europe with incorrect European keyboard layout. Jennifer Davis, a Dell spokeswoman commented on the story. She pointed out that only a limited number of Vostro 1310 and 1510 laptops with the wrong keyboard layout were shipped in Europe in the middle of April. Fortunately, Dell has stopped further shipments of the laptop models until the problem is fixed. All "lucky" owners of the faulty keyboard laptops will be offered a replacement. "Customers will be given a choice to receive the keyboard kit or have a tech [representative] come on-site, ... The new keyboard is easy to install," Davis said. Laptops shipped outside Europe aren't affected by the glitch.
Source: Yahoo! News
MSI's Ultra Portable Notebook
MSI is entering the Eee PC champion league with some tricked out Wind notebook. While you won't be blown away by performance or by the looks of it, Wind U100 will be MSIÂ’s first major fighter against Eee that is claimed to beat it in 6 out of 9 design specification. Shipping in mid to late May, the U100 will get its power from an Intel Atom 1.6GHz processor based on a Intel 945GM motherboard, up to 2GB DDR2 667MHz memory, 80GB 2.5-inch SATA hard drive and a 10-inch WSVGA LCD with 1024x600 wide resolution, that MSI claims is much better for web surfing compared to Eee PC. Also included is a 4-in-1 card reader, three USB 2.0 ports, GB network port, 802.11B/G wireless and Bluetooth V2.0 EDR. Multimedia features will get you HD audio through integrated stereo speakers and video from a 1.3MP camera. The MSI Wind will ship with either Windows XP or Linux OS. Also MSI promises two battiry options: 3 cell and 6 cell. With the 3 cell battery installed, the whole system will weigh less than a kilo and measure 260x180x19-31.5mm. See some more pictures at TweakTown.
Source: TweakTown
Windows XP Service Pack 3 Release to Web Delayed
Windows XP Service Pack 3 was supposed to land today for mass download, but I'm afraid this won't happen. Microsoft today explained what's the main reason behind this last moment delay:
In the last few days, we have uncovered a compatibility issue between Microsoft Dynamics Retail Management System (RMS) and both Windows XP SP3 and Windows Vista Service Pack 1 (SP1). In order to make sure customers have the best possible experience, we have decided to delay releasing Windows XP Service Pack 3 (SP3) to the web. To help protect customers, we plan to put filtering in place shortly to prevent Windows Update from offering both service packs to systems running Microsoft Dynamics RMS. Once filtering is in place, we expect to release Windows XP SP3 to the web.
I suppose many of you already know about the leaked Windows XP SP3 download link, but I prefer to post only legit links here. Microsoft is working on fixing the problem and should release Windows XP SP3 to web very soon.
Source: Microsoft TechNet Forums